HSINCHU, Taiwan–(BUSINESS WIRE)–TSMC (TWSE: 2330, NYSE: TSM) is unveiling its newest improvements in superior logic expertise, specialty applied sciences, and TSMC 3DFabric™ superior packaging and chip stacking applied sciences on the Firm’s 2021 Know-how Symposium. Going down on-line for a second 12 months, the symposium connects prospects with TSMC’s new choices, together with N6RF for next-generation 5G smartphone and WiFi 6/6e efficiency, N5A for state-of-the-art automotive purposes, and enhancements throughout the vary of 3DFabric applied sciences. Over 5,000 prospects and expertise companions all over the world have registered for our 2021 Know-how Symposium, being held from June 1-2.
“Digitalization is reworking society quicker than ever as folks use expertise to beat the obstacles created by the worldwide pandemic to attach, collaborate, and remedy issues,” stated Dr. C.C. Wei, CEO of TSMC. “This digital transformation has opened up a brand new world filled with alternatives for the semiconductor trade. Our international Know-how Symposium highlights lots of the methods we’re enhancing and increasing our expertise portfolio to unleash our prospects’ improvements.”
Superior Know-how Management – N5, N4, N5A, and N3
TSMC was first within the trade to carry 5 nanometer (nm) expertise into quantity manufacturing in 2020 with defect density enhancing quicker than the previous 7nm technology. The N4 enhancement to the 5nm household additional improves efficiency, energy effectivity and transistor density together with the discount of masks layers and shut compatibility in design guidelines with N5. TSMC N4 improvement has proceeded easily since its announcement on the 2020 Know-how Symposium, with threat manufacturing set for the third quarter of 2021.
TSMC is introducing N5A, the latest member of the 5nm household; the N5A course of is geared toward satisfying the rising demand for computing energy in newer and extra intensive automotive purposes akin to AI-enabled driver help and the digitization of car cockpits. N5A brings the identical expertise utilized in supercomputers right now to automobiles, packing the efficiency, energy effectivity, and logic density of N5 whereas assembly the stringent high quality and reliability necessities of AEC-Q100 Grade 2 in addition to different automotive security and high quality requirements. TSMC N5A is supported by the flourishing TSMC automotive design enablement platform and scheduled to be obtainable in third quarter of 2022.
TSMC’s N3 expertise is poised to be the world’s most superior expertise when it begins quantity manufacturing within the second half of 2022. Counting on the confirmed FinFET transistor structure for the most effective efficiency, energy effectivity, and price effectiveness, N3 will supply as much as 15% velocity achieve or eat as much as 30% much less energy than N5, and supply as much as 70% logic density achieve.
Superior Radio Frequency Know-how for the 5G Period – N6RF
5G smartphones require extra silicon space and eat extra energy to ship increased wi-fi information charges in contrast with 4G. 5G enabled chips combine extra performance and parts and are more and more rising in measurement and competing in opposition to the battery for a restricted quantity of area contained in the smartphone.
TSMC debuted the N6RF course of, which brings the ability, efficiency, and space advantages of its superior N6 logic course of to 5G radio frequency (RF) and WiFi 6/6e options. N6RF transistors obtain greater than 16% increased efficiency over the prior technology of RF expertise at 16nm. Moreover, N6RF helps important energy and space discount for 5G RF transceivers for each sub-6 gigahertz and millimeter wave spectrum bands with out compromising efficiency, options and battery life supplied to customers. TSMC N6RF can even improve WiFi 6/6e efficiency and energy effectivity.
TSMC 3DFabric System Integration Options
TSMC continues to broaden its complete 3DFabric household of 3D silicon stacking and superior packaging applied sciences.
- For top-performance computing purposes, TSMC will likely be providing bigger reticle-size for each its InFO_oS and CoWoS® packaging options in 2021, enabling bigger flooring plans for chiplet and high-bandwidth reminiscence integration. Moreover, the chip-on-wafer (CoW) model of TSMC-SoIC™ will likely be certified on N7-on-N7 this 12 months with manufacturing focused for 2022 at a brand new fully-automated manufacturing unit.
- For cellular purposes, TSMC is introducing its InFO_B answer, designed to combine a robust cellular processor in a slim, compact package deal with enhanced efficiency and energy effectivity and help cellular gadget makers’ DRAM stacking on the package deal.
TSMC pioneered the pure-play foundry enterprise mannequin when it was based in 1987, and has been the world’s main devoted semiconductor foundry ever since. The Firm helps a thriving ecosystem of world prospects and companions with the trade’s main course of applied sciences and portfolio of design enablement options to unleash innovation for the worldwide semiconductor trade. With international operations spanning Asia, Europe, and North America, TSMC serves as a dedicated company citizen all over the world.
TSMC deployed 281 distinct course of applied sciences, and manufactured 11,617 merchandise for 510 prospects in 2020 by offering broadest vary of superior, specialty and superior packaging expertise companies. TSMC is the primary foundry to supply 5-nanometer manufacturing capabilities, essentially the most superior semiconductor course of expertise obtainable on this planet. The Firm is headquartered in Hsinchu, Taiwan. For extra data please go to https://www.tsmc.com.